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英文論文誌 Trans JIEP

英文論文誌"Transactions of The Japan Institute of Electronics Packaging(Trans JIEP)"2008年から発刊しています。

Trans JIEP表紙

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Trans JIEPの特色

  • 国内外から広く研究論文・技術報告等を募集、掲載しています。
  • 研究内容を海外に発信するため、フリーアクセスで記事を公開しています。
  • 2016年から、掲載が決まった論文からエレクトロニクス実装学会のホームページで随時公開し、速報性を高めています。

Trans JIEPの論文投稿について

論文投稿に関する連絡先

エレクトロニクス実装学会編集事務局:hensyu(at)jiep.or.jp
※メール送信の際(at)をアットマークに変更してください。

Trans JIEP最新号

Transactions of The Japan Institute of Electronics Packaging Vol. 10
DEC. 2017

Technical papers

Authors Title Start page
S. Sawada et al. Novel Wiring Structure for 3D-Conformable Devices E16-017-1
K. Hine et al. Effects of Sb Addition on Phase Transformation and Thermal Fatigue in Sn-Ag-Bi-In Solder Joints E16-006-1
R. Kibushi et al. Assumption of Heat Generation in CFD Analysis for Accurate Tempearture Distribution of Power Si MOSFET E16-016-1
Y. Aruga et al. Relationship between Copper Patterns and Temperature Rise of Printed Circuit Board for Small Surface Mount Electronic Components in Terms of Constriction Thermal Resistance E16-012-1

 

Transactions of The Japan Institute of Electronics Packaging Vol.9
Dec. 25 2016

Preface

Authors Title Start page
M. Aoyagi Message from the Editor  

Technical papers

Authors Title Start page
H. Sakakibara et al. Advanced Plating Photoresist Development for Semiconductor Packages E15-007-1
J. C-C. Lo et al. Numerical Prediction and Experimental Validation of Multiple Phosphor White LED Spectrum E16-005-1
A. Satoh et al. Investigation on Microstructure and Resistivity in Cu-TSVs for 3D Packaging E16-010-1
T. Enami et al. Evaluation of Relationship between Residual Stress on Chip Using Non-Conductive Film and Package Warpage Caused by Flip-Chip Bonding Process Using Test Element Group Chips with Piezoresistive Sensors E16-004-1
M. Yamaguchi et al. Selective Laser Sintering with Gold Nanoparticles on Stainless Steel for Electrical Components E16-008-1
S. Ishida et al. Estimation of Wire Bonding State by the Ensemble Based MT Method and Thin AE Sensor E16-002-1
C. F. Bayer et al. Partial Discharges in Ceramic Substrates - Correlation of Electric Field Strength Simulations with Phase Resolved Partial Discharge Measurements E16-003-1
K. Mitsukura et al. Packaging Material Evaluation for 2.5D/3D TSV Application E16-011-1
H. Kanemoto et al. Applying Copper-Ball Dissolution for Prolonging Life of Electroless-Copper-Plating Solution E16-001-1
S. Ishida et al. Improvement of Sampling Inspection for Wire Bonding Using Taming and Thin Film AE Sensor E16-015-1
C-K Lee et al. Reliability Evaluation for Integrated Glass Interposer E16-009-1
K. Yuki et al. Immersion Cooling of Electronics Utilizing Lotus-Type Porous Copper E16-013-1
J. Hatakeyama et al. Basic Study on Reduction of Measurement Time for Evaluating Thermophysical Properties of Thermal Interface Materials by Steady Temperature Prediction Method E16-014-1

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