High-Speed High-Density Cost-Effective Cu-Filled Through-Glass-Via Channel for Heterogeneous Chip Integration
Hiroshi Kudo, Miyuki Akazawa, Shouhei Yamada, Masaya Tanaka, Haruo Iida, Jyunya Suzuki, Takamasa Takano, Satoru Kuramochi, DNP Co., Ltd. / Japan

Processing and Characterization of Die-Attach on Uncoated Copper by Pressure-Less Silver Sintering and Low-Pressure-Assisted Copper Sintering
Meiyu Wang¹, Yanliang Shan¹ , Yunhui Mei¹ , Xin Li¹, Guo-Quan Lu^1,2, ¹Tianjin University / China, ²Virginia Tech / USA

Inhibition of Cracking in Cu₆Sn₅ intermetallic Compounds at the Interface of Lead-Free Solder Joint by Controlling the Reflow Cooling Conditions
Flora Somidin^1,2, Stuart D. McDonald¹, Xiaozou Ye¹, Dongdong Qu¹, Keith Sweatman³, Tetsuya Akaiwa³, Tetsuro Nishimura³, Kazuhiro Nogita¹, ¹The University of Queensland / Australia, ²Universiti Malaysia Perlis / Malaysia, ³Nihon Superior Co., Ltd. / Japan

High-Toughness (111) Nano-Twinned Copper Lines for Fan-Out Wafer-Level Packaging
Yu-Jin Li¹, Wei-Yu Hsu¹, Benson Lin², ChiaCheng Chang², Chie Chen¹, ¹National Chiao Tung University, ²MediaTek Inc. / Taiwan

Programming and Evaluation of a Multi-Axis/Multi-Process Manufacturing System for Mechatronic Integrated Devices
M.Ankenbrand, Y.Eiche, J.Franke, Fridrich-Alexander University Erlangen-Nuremberg / Germany

Correlation between Insertion Loss and Interface Relative Conductivity
Taiga Fukumori, Fujitsu Laboratories Ltd. / Japan

Evaluation and Benchmarking of Cu Pillar Micro-Bumps with Printed Polymer Core
Xing Qiu, Hong Kong University of Science & Technology / Hong Kong

Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition
Hiroyuki Kuwae, Waseda University / Japan

A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere
Runhua Gao, Osaka University / Japan

Au-Sn Soldering Using a Micro-heater to Restrain Excess Temperature Rise Inside the Package
Hideaki Mizusaki, Toshiro Sato, Makoto Sonehara, Shinshu University / Japan

Wafer-scale Au-Au surface activated Bonding Using Atmospheric-Pressure Plasma
Michitaka Yamamoto^1,2, Takashi Matsumae², Yuichi Kurashima², Hideki Takagi², Toshihiro Miyake³, Tadatomo Suga¹, Toshihiro Itoh¹, and Eiji Higurashi^1,2, ¹The University of Tokyo, ²National Institute of Advanced Industrial Science and Technology, ³Denso Corporation / Japan

Study of Low-Residual Stress Amorphous Film Deposition Method for LiTaO₃ / Quartz or LiNbO₃ / Quartz Bonding toward 5G Surface Acoustic Wave Devices
Ami Tezuka¹, Hiroyuki Kuwae¹, Kosuke Yamada¹, Shuichi Shoji¹, Shoji Kakio², Jun Mizuno^1,3
1Waseda University, ²Yamanashi University / Japan, ³Soochow University / China

[Important Notice] Cancellation of ICEP 2020

It is with deep regret that we are informing you of the cancellation of the ICEP 2020 due to the ongoing situations of the new coronavirus (COVID-19) epidemics in Japan. The health and safety of all the participants is our top priority. Please accept our deepest apologies for any inconvenience this may have caused. We sincerely appreciate your cooperation and understanding.

Our cancellation policy of the ICEP 2020 is as follows.

• All presentation sessions are cancelled.
• All submitted papers will not be published in the Proceedings.�@Accordingly, the full copyright will revert to the author as original copyright holder.
• We will refund the full registration fee that you have already paid to us.
• We will refund the full sponsor fee that you have already paid to us.

Regarding the refund method, we will inform the details later by e-mail.

We look forward to seeing you at next ICEP 2021 in the future.